Technical Milestones

2019

  • Sep eMemory IP Garners Most Stringent Level of Certification for Automotive Applications
  • Jun eMemory’s NeoFuse Qualified on Winbond 25nm DRAM Process

2018

  • Oct NeoFuse is qualified on Fully-Depleted Silicon On-Insulator (FD-SOI) process technology
  • Aug eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on BCD Process
  • Apr Over 20 Million Wafers Embedded with eMemory’s IP Shipped

2017

  • Oct Over 18,000,000 Wafers Embedded with eMemory’s IP Shipped
  • Jul eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes
  • May eMemory Taps into IoT Markets with its Game-Changing Security IP
  • Apr Over 100,000 Wafers Embedded with eMemory’s NeoEE IP Shipped
  • Mar eMemory’s NeoFuse Implemented in HV Process for OLED Application
  • Feb eMemory Qualified NeoFuse in TSMC 16FFC Process

2016

  • Nov eMemory’s NeoFuse IP Verified in TSMC 10nm FinFET Process
  • Aug eMemory Unveils EcoBit Technology for RFID and NFC Applications
  • Jul eMemory Announces Comprehensive NVM Solution in 0.13um BCD Process for PMIC Applications
  • Jul eMemory’s NeoEE Solution Facilitates Module Integration for Fingerprint Applications
  • May eMemory NeoFuse IP Qualified in 40nm EHV Process
  • Apr eMemory Launches Enhanced NeoFuse IP for IoT Applications
  • Mar eMemory NeoEE silicon IP passes qualification in GLOBALFOUNDRIES 0.18um Green process
  • Mar eMemory Announces Industry’s First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP
  • Mar eMemory Announces Innovative Solution for Cryptographic Security
  • Jan eMemory’s NeoFuse Technology: A Major Advance in Automotive Panel Driver IC

2015

  • Sep eMemory announces the first verified NeoFuse OTP IP in 16nm FinFET Plus process
  • Aug eMemory NeoMTP silicon IP passes verification in UMC 80nm high-voltage process
  • Aug eMemory NeoFuse silicon IP passes verification in TSMC 16nm FinFET Plus process
  • Aug eMemory NeoFuse silicon IP passes qualification in UMC 28nm low-power process
  • Aug eMemory integrates OTP and MTP to offer industry-leading Combo and Hybrid silicon IPs
  • Jul eMemory NeoFuse silicon IP passes verification in PowerChip 63nm DRAM process
  • Jul eMemory NeoFuse silicon IP passes verification in GLOBALFOUNDRIES 55nm high-voltage process
  • Jul eMemory offers logic NVM solutions to enhance IC performance for camera modules
  • Jun eMemory NeoFuse silicon IP passes verification in UMC 55nm CMOS-image sensor process
  • Jun eMemory NeoFuse silicon IP passes verification in TSMC 0.13um BCD process
  • Jun eMemory launches ultra-low power MTP silicon IP for IoT applications
  • Jun eMemory NeoEE silicon IP passes verification in GLOBALFOUNDRIES 0.18um 3.3V MCU process
  • May eMemory NeoFuse silicon IP passes verification in VIS 0.15um 1.8V/13.5V process
  • May eMemory NeoFuse technology is verified in 16nm FinFET process
  • Mar eMemory NeoFuse silicon IP passes qualification in TSMC 40nm low-power process
  • Mar Andes and eMemory announce new IC security solutions for IoT security applications
  • Feb eMemory NeoFuse silicon IP passes qualification in GLOBALFOUNDRIES 28nm low-power process
  • Feb eMemory NeoFuse silicon IP passes qualification in SMIC 40nm low-power process
  • Feb Fingerprint application opens up market demands for eMemory’s logic NVM IP solutions
  • Jan eMemory NeoEE silicon IP passes verification in HHGrace 0.13um 1.5V/3.3V low-power process
  • Jan eMemory NeoFuse silicon IP passes verification in SMIC 28nm low-power process
  • Jan eMemory NeoFuse silicon IP passes qualification in UMC 55nm high-voltage process

2014

  • Dec eMemory NeoFuse silicon IP passes qualification in TSMC 55nm high-voltage process
  • Dec eMemory NeoFuse silicon IP passes qualification in TSMC 55nm low-power process
  • Nov eMemory NeoFuse silicon IP passes qualification in TSMC 28nm low-power process
  • Nov eMemory offers IP industry-leading hybrid MTP silicon IP
  • Oct eMemory NeoEE silicon IP advances into automotive electronics applications
  • Sep eMemory NeoMTP silicon IP passes qualification in UMC 0.11um logic process
  • Sep eMemory NeoEE silicon IP passes verification in HHGrace 0.18m logic process
  • Sep eMemory NeoFuse silicon IP passes qualification in TSMC 28nm HKMG 2.5V process
  • Aug eMemory provides tailor-made MTP solutions in low-cost Green process platforms, develops diverse MCU product range
  • Jul eMemory’s eNVM silicon IP NeoFuse contributes to revenue growth momentum
  • Jul eMemory NeoEE silicon IP expands wireless communication ICs applications
  • Jun eMemory NeoEE silicon IP passes verification in HHGrace 0.18m 3.3V cost-effective process
  • Jun eMemory NeoFuse silicon IP passes qualification in SMIC 55nm low-power process
  • Apr eMemory NeoEE silicon IP passes qualification in UMC 0.18m BCD process
  • Apr eMemory's silicon IP introduced to electro-medical applications
  • Mar eMemory's silicon IP NeoFuse received CA certification for advanced security applications
  • Feb eMemory NeoEE silicon IP passes qualification in UMC 0.3m BCD process
  • Feb eMemory NeoFuse silicon IP passes qualification in UMC 40nm low-power process
  • Feb eMemory offers mature Full-HD SDDI solutions in advanced 55nm high-voltage process
  • Feb eMemory expands NeoFlash’s industrial applications
  • Jan eMemory NeoMTP silicon IP passes verification in UMC 0.11um logic process
  • Jan eMemory NeoEE silicon IP passes qualification in HHGrace 0.11um 1.5V/3.3V low-power process

2013

  • Dec eMemory and SMIC expand partnership in eNVM technical development
  • Dec MagnaChip and eMemory offer 0.18um EEPROM silicon IP
  • Oct eMemory NeoEE silicon IP passes verification in HHGrace 0.153um logic process
  • Oct eMemory NeoEE silicon IP passes verification in UMC 0.3m BCD process
  • Oct eMemory NeoEE silicon IP passes verification in UMC 0.18m BCD process
  • Sep eMemory's NeoMTP technology advances in extensive Touch Panel MCU and TDDI applications
  • Aug eMemory NeoEE silicon IP passes qualification in SMIC 0.18um logic process
  • Aug eMemory's NeoEE technology advances into BCD process platform, augmenting P-Gamma silicon IP product range and accelerating integration with power management ICs
  • Aug eMemory offers mature Full-HD SDDI solutions in advanced 55nm high-voltage process
  • Jun eMemory NeoEE silicon IP passes qualification in TSMC 0.16um mixed-signal process
  • Jun eMemory and UMC expand non-volatile memory cooperation to advanced 28nm process
  • May eMemory develops NeoFuse—an innovative anti-fuse eNVM technology
  • Mar eMemory NeoEE Silicon IP passes verification in TSMC 0.16um mixed-signal process
  • Mar Production of eMemory's eNVM silicon IPs reaches 5 million wafers
  • Jan eMemory's NeoEE silicon IP qualified for 2.4GHz RF product application

2012

  • Dec eMemory NeoEE silicon IP passes verification in SMIC 0.18um logic process
  • Dec MagnaChip joins eMemory in developing leading-edge 0.18um EEPROM IP
  • Nov NeoFlash in 0.11um logic process qualified and enters mass production, demonstrating the best solution for touch-panel applications
  • Sep eMemory introduces new NeoMTP technology
  • Jul eMemory's embedded MTP solution- NeoEE passes verification in 65nm process node
  • May eMemory’s NeoBit silicon IP to play important role in MEMS applications
  • Mar eMemory and HLMC collaborate on high-voltage advanced fabrication platform
  • Mar eMemory announces ultra-low power OTP solution in low-cost process platform

2011

  • Dec NeoBit in 65nm is qualified in a Tier 1 foundry and enters mass production
  • Dec eMemory masters developing trends in technology and expands into advanced technology
  • Nov eMemory NeoBit silicon IP advances in 3D image application
  • Oct eMemory and Grace Semiconductor expand partnership, developing diverse solutions and advanced processes
  • Jul eMemory offers eNVM IP in TSMC 80nm high-voltage technology
  • Jun eMemory's NeoBit OTP qualified at 12" foundry in 80nm technology
  • Apr eMemory's NeoEE verified, targets NFC applications
  • Mar Use of touch panel controllers and energy-saving devices proliferates, leading to significant growth in NeoFlash applications
  • Mar Volume production of cost-effective OTP solution for MCU application with GSMC

2010

  • Dec eMemory NeoFlash offers an unrivalled, highly reliable embedded flash solution for automotive electronic applications
  • Jul eMemory becomes the first automotive-grade OTP provider to automotive IC makers
  • Jul eMemory announces industry’s first Green High Density OTP solution
  • Jun NeoEE in 0.18um process demonstrates ultra-high endurance (100,000) performance
  • May eMemory responds to market needs by offering complete set of multiple-time programmable (MTP) embedded NVM solutions
  • Mar eMemory collaborates with MagnaChip to offer 0.11um high-voltage embedded NVM technology
  • Mar eMemory announces NeoEE prototype in 0.18um process technology

2009

  • Nov Successful development of high-density OTP in advanced high-voltage process to meet requirement for larger memory when LCD driver and touch panel applications are combined in one chip
  • Sep eMemory breaks new ground launching industrial-grade embedded NVM for power management solution
  • Jul eMemory’s NeoBit OTP production reaches 1 million wafers; IP solutions for 65 nm processes launched
  • May eMemory announces NeoROM, a low-cost OTP mass production solution
  • Jan NeoFlash in 0.13um process demonstrates ultra-low power program/erase performance

2008

  • Dec NeoFlash qualified in 0.18um ULL process
  • Dec Production of NeoBit reaches 900,000 wafers
  • Nov 0.13um high-voltage NeoBit process for LCD driver applications goes into mass production
  • May eMemory licenses technology to Fujitsu Microelectronics Limited
  • Feb Production of NeoBit reaches 400,000 wafers

2007

  • Nov NeoBit qualified in 0.13um high-voltage process for LCD driver applications
  • Oct Production of NeoBit reaches 300,000 wafers
  • Sep eMemory licenses technology to Magnachip
  • Jul eMemory customers adopt 0.13um NeoBit in mass production
  • Jul eMemory licenses technology to NECEL
  • Mar Production of NeoBit reaches 150,000 wafers

2006

  • Oct NeoBit production reaches 100,000 wafers
  • Jul eMemory provides high voltage NeoBit processes and improves wafer yield and performance
  • Apr eMemory licenses technology to Silterra
  • Apr Advance NeoFlash embedded non-volatile memory technology is qualified
  • Mar eMemory licenses technology to NJRC
  • Mar eMemory licenses technology to OKI

2005

  • Oct eMemory licenses technology to Toshiba
  • Jun Production of NeoBit reaches 10,000 wafers
  • Apr eMemory licenses technology to Powerchip Semiconductor Corporation (PSC)
  • Apr eMemory licenses technology to Ricoh
  • Mar eMemory announces NeoBit prototype in 0.13um process
  • Jan eMemory licenses technology to Vanguard International Semiconductor Corporation (VIS)
  • Jan eMemory announces NeoBit applications for speech IC

2004

  • Oct eMemory provides 0.18um NeoBit OTP/MTP solutions for LCD driver IC
  • Oct eMemory announces NeoBit prototype in 0.11um technology for DRAM redundancy
  • Aug eMemory announces NeoBit applications for RFID
  • Jun eMemory announces NeoBit applications for trimming circuit in LCD driver
  • Jan eMemory licenses technology to Chartered Semiconductor

2003

  • Oct eMemory announces NeoBit applications for electrical fuse
  • Sep eMemory licenses technology to Taiwan Semiconductor Manufacturing Company (TSMC)
  • Apr eMemory announces NeoBit applications for ROM replacement in MCU
  • Apr eMemory licenses technology to Renesas Technology

2002

  • Nov eMemory licenses technology to Chartered Semiconductor
  • Apr eMemory licenses technology to Mitsubishi Electric