eMemory and UMC Expand Non-volatile Memory Cooperation to Advanced 28nm Process
Hsinchu, Taiwan (Jun. 10, 2013)- eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-times-programmable (MTP) embedded non-volatile memory technologies into UMC’s 28nm process. The agreement will broaden the foundry’s specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.
eMemory President Dr. Rick Shen pointed out, "We are happy to take our important strategic partner UMC to a higher level. We stand by our core principles of "embedded wisely, embedded widely", as we incorporate our core technologies into UMC’s process platforms. This represents the integration of the strengths of both companies and will allow us to provide our IC design clients eNVM platforms that boast quality and reliability, thereby enabling them to stay ahead of the rest of the market."
eMemory's eNVM technologies target a wide range of applications in mainstream consumer electronics, including power management ICs for smart phones and tablet computers, advanced LCD drivers, touch panel controllers, battery management, sensor controller, audio codec, and near field communications. The current silicon IP (SIP) includes NeoBit, NeoFuse, NeoMTP, NeoFlash, and NeoEE, making eMemory the top provider in the industry for providing a full array of SIP products for both OTP and MTP eNVM technologies.
eMemory's MTP technology can be applied for different product needs including <10 times programming, low-medium or medium-high densities with high endurance requirements, and multiple-times-programmable embedded non-volatile memory technology applications. Furthermore, the technologies are highly compatible with logic processes for different process generations, making eMemory an ideal partner for wafer foundries seeking seamless eNVM integration into their process platforms.
S.C. Chien, senior vice president in charge of the IP & Design Support division at UMC, said, “We are happy to extend our long-term collaboration with eMemory that dates back to 2006. eMemory's OTP and MTP technologies are a welcome addition to UMC’s 28nm technology platform, further adding to the many specialty process options available to UMC customers. By providing better and more comprehensive eNVM technologies for different customer requirements, we can increase the competiveness of their system-on–chip designs both now and for their future product migration.”