Milestones
Technical Milestones
2024
- Jul eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- Jan eMemory’s Security-Enhanced OTP Qualifies on TSMC N4P Process
2023
- Dec eMemory is certified ISO 26262 - Functional Safety of Road Vehicles
- Apr eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
- Mar eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification
2022
- Nov eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications
- Jun UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP
- Feb eMemory Partners with Intel Foundry Services to Boost Security in Leading-Edge Chips
2021
- Nov eMemory’s Resistive Random Access Memory (ReRAM) IP Qualified on UMC’s 40nm process
- Sep eMemory’s Security-Enhanced OTP IP Qualified on TSMC N6 Process
- Mar Over 35 Million Wafers Embedded with eMemory’s IP Shipped
2020
- Aug NeoFuse Completes the Qualification for Automotive Grade IPs on Samsung’s 28nm FD-SOI Process.
- Aug NeoFuse Completes the Silicon Verification on TSMC’s 5nm and 6nm Processes.
- Aug Launched PUF-based Solutions (PUFrt and PUFiot) with NeoPUF as Core Technology
- Mar NeoMTP Successfully Applied to TSMC’s Third-Generation 0.18μm BCD Process
- Jan NeoFuse Successfully Applied to UMC’s 28nm HV Process Targeting the Fast-growing OLED Market
2019
- Dec eMemory Joins Arm Ecosystem for Secure IoT Chips
- Sep eMemory's NeoBit and NeoEE IP are certified for ISO 26262 and IEC 61508
- Jun eMemory’s NeoFuse Qualified on Winbond 25nm DRAM Process
2018
- Oct NeoFuse is qualified on Fully-Depleted Silicon On-Insulator (FD-SOI) process technology
- Aug eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on BCD Process
- Apr Over 20 Million Wafers Embedded with eMemory’s IP Shipped
2017
- Oct Over 18,000,000 Wafers Embedded with eMemory’s IP Shipped
- Jul eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes
- May eMemory Taps into IoT Markets with its Game-Changing Security IP
- Apr Over 100,000 Wafers Embedded with eMemory’s NeoEE IP Shipped
- Mar eMemory’s NeoFuse Implemented in HV Process for OLED Application
- Feb eMemory Qualified NeoFuse in TSMC 16FFC Process
2016
- Nov eMemory’s NeoFuse IP Verified in TSMC 10nm FinFET Process
- Aug eMemory Unveils EcoBit Technology for RFID and NFC Applications
- Jul eMemory’s NeoEE Solution Facilitates Module Integration for Fingerprint Applications
- Jul eMemory Announces Comprehensive NVM Solution in 0.13um BCD Process for PMIC Applications
- May eMemory NeoFuse IP Qualified in 40nm EHV Process
- Apr eMemory Launches Enhanced NeoFuse IP for IoT Applications
- Mar eMemory Announces Innovative Solution for Cryptographic Security
- Mar eMemory Announces Industry’s First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP
- Mar eMemory NeoEE silicon IP passes qualification in GLOBALFOUNDRIES 0.18um Green process
- Jan eMemory’s NeoFuse Technology: A Major Advance in Automotive Panel Driver IC
2015
- Sep eMemory announces the first verified NeoFuse OTP IP in 16nm FinFET Plus process
- Aug eMemory integrates OTP and MTP to offer industry-leading Combo and Hybrid silicon IPs
- Aug eMemory NeoFuse silicon IP passes qualification in UMC 28nm low-power process
- Aug eMemory NeoFuse silicon IP passes verification in TSMC 16nm FinFET Plus process
- Aug eMemory NeoMTP silicon IP passes verification in UMC 80nm high-voltage process
- Jul eMemory offers logic NVM solutions to enhance IC performance for camera modules
- Jul eMemory NeoFuse silicon IP passes verification in GLOBALFOUNDRIES 55nm high-voltage process
- Jul eMemory NeoFuse silicon IP passes verification in PowerChip 63nm DRAM process
- Jun eMemory NeoEE silicon IP passes verification in GLOBALFOUNDRIES 0.18um 3.3V MCU process
- Jun eMemory launches ultra-low power MTP silicon IP for IoT applications
- Jun eMemory NeoFuse silicon IP passes verification in TSMC 0.13um BCD process
- Jun eMemory NeoFuse silicon IP passes verification in UMC 55nm CMOS-image sensor process
- May eMemory NeoFuse technology is verified in 16nm FinFET process
- May eMemory NeoFuse silicon IP passes verification in VIS 0.15um 1.8V/13.5V process
- Mar Andes and eMemory announce new IC security solutions for IoT security applications
- Mar eMemory NeoFuse silicon IP passes qualification in TSMC 40nm low-power process
- Feb Fingerprint application opens up market demands for eMemory’s logic NVM IP solutions
- Feb eMemory NeoFuse silicon IP passes qualification in SMIC 40nm low-power process
- Feb eMemory NeoFuse silicon IP passes qualification in GLOBALFOUNDRIES 28nm low-power process
- Jan eMemory NeoFuse silicon IP passes qualification in UMC 55nm high-voltage process
- Jan eMemory NeoFuse silicon IP passes verification in SMIC 28nm low-power process
- Jan eMemory NeoEE silicon IP passes verification in HHGrace 0.13um 1.5V/3.3V low-power process
2014
- Dec eMemory NeoFuse silicon IP passes qualification in TSMC 55nm low-power process
- Dec eMemory NeoFuse silicon IP passes qualification in TSMC 55nm high-voltage process
- Nov eMemory offers IP industry-leading hybrid MTP silicon IP
- Nov eMemory NeoFuse silicon IP passes qualification in TSMC 28nm low-power process
- Oct eMemory NeoEE silicon IP advances into automotive electronics applications
- Sep eMemory NeoFuse silicon IP passes qualification in TSMC 28nm HKMG 2.5V process
- Sep eMemory NeoEE silicon IP passes verification in HHGrace 0.18m logic process
- Sep eMemory NeoMTP silicon IP passes qualification in UMC 0.11um logic process
- Aug eMemory provides tailor-made MTP solutions in low-cost Green process platforms, develops diverse MCU product range
- Jul eMemory NeoEE silicon IP expands wireless communication ICs applications
- Jul eMemory’s eNVM silicon IP NeoFuse contributes to revenue growth momentum
- Jun eMemory NeoFuse silicon IP passes qualification in SMIC 55nm low-power process
- Jun eMemory NeoEE silicon IP passes verification in HHGrace 0.18m 3.3V cost-effective process
- Apr eMemory's silicon IP introduced to electro-medical applications
- Apr eMemory NeoEE silicon IP passes qualification in UMC 0.18m BCD process
- Mar eMemory's silicon IP NeoFuse received CA certification for advanced security applications
- Feb eMemory expands NeoFlash’s industrial applications
- Feb eMemory offers mature Full-HD SDDI solutions in advanced 55nm high-voltage process
- Feb eMemory NeoFuse silicon IP passes qualification in UMC 40nm low-power process
- Feb eMemory NeoEE silicon IP passes qualification in UMC 0.3m BCD process
- Jan eMemory NeoEE silicon IP passes qualification in HHGrace 0.11um 1.5V/3.3V low-power process
- Jan eMemory NeoMTP silicon IP passes verification in UMC 0.11um logic process
2013
- Dec MagnaChip and eMemory offer 0.18um EEPROM silicon IP
- Dec eMemory and SMIC expand partnership in eNVM technical development
- Oct eMemory NeoEE silicon IP passes verification in UMC 0.18m BCD process
- Oct eMemory NeoEE silicon IP passes verification in UMC 0.3m BCD process
- Oct eMemory NeoEE silicon IP passes verification in HHGrace 0.153um logic process
- Sep eMemory's NeoMTP technology advances in extensive Touch Panel MCU and TDDI applications
- Aug eMemory offers mature Full-HD SDDI solutions in advanced 55nm high-voltage process
- Aug eMemory's NeoEE technology advances into BCD process platform, augmenting P-Gamma silicon IP product range and accelerating integration with power management ICs
- Aug eMemory NeoEE silicon IP passes qualification in SMIC 0.18um logic process
- Jun eMemory and UMC expand non-volatile memory cooperation to advanced 28nm process
- Jun eMemory NeoEE silicon IP passes qualification in TSMC 0.16um mixed-signal process
- May eMemory develops NeoFuse—an innovative anti-fuse eNVM technology
- Mar Production of eMemory's eNVM silicon IPs reaches 5 million wafers
- Mar eMemory NeoEE Silicon IP passes verification in TSMC 0.16um mixed-signal process
- Jan eMemory's NeoEE silicon IP qualified for 2.4GHz RF product application
2012
- Dec MagnaChip joins eMemory in developing leading-edge 0.18um EEPROM IP
- Dec eMemory NeoEE silicon IP passes verification in SMIC 0.18um logic process
- Nov NeoFlash in 0.11um logic process qualified and enters mass production, demonstrating the best solution for touch-panel applications
- Sep eMemory introduces new NeoMTP technology
- Jul eMemory's embedded MTP solution- NeoEE passes verification in 65nm process node
- May eMemory’s NeoBit silicon IP to play important role in MEMS applications
- Mar eMemory announces ultra-low power OTP solution in low-cost process platform
- Mar eMemory and HLMC collaborate on high-voltage advanced fabrication platform
2011
- Dec eMemory masters developing trends in technology and expands into advanced technology
- Dec NeoBit in 65nm is qualified in a Tier 1 foundry and enters mass production
- Nov eMemory NeoBit silicon IP advances in 3D image application
- Oct eMemory and Grace Semiconductor expand partnership, developing diverse solutions and advanced processes
- Jul eMemory offers eNVM IP in TSMC 80nm high-voltage technology
- Jun eMemory's NeoBit OTP qualified at 12" foundry in 80nm technology
- Apr eMemory's NeoEE verified, targets NFC applications
- Mar Volume production of cost-effective OTP solution for MCU application with GSMC
- Mar Use of touch panel controllers and energy-saving devices proliferates, leading to significant growth in NeoFlash applications
2010
- Dec eMemory NeoFlash offers an unrivalled, highly reliable embedded flash solution for automotive electronic applications
- Jul eMemory announces industry’s first Green High Density OTP solution
- Jul eMemory becomes the first automotive-grade OTP provider to automotive IC makers
- Jun NeoEE in 0.18um process demonstrates ultra-high endurance (100,000) performance
- May eMemory responds to market needs by offering complete set of multiple-time programmable (MTP) embedded NVM solutions
- Mar eMemory announces NeoEE prototype in 0.18um process technology
- Mar eMemory collaborates with MagnaChip to offer 0.11um high-voltage embedded NVM technology
2009
- Nov Successful development of high-density OTP in advanced high-voltage process to meet requirement for larger memory when LCD driver and touch panel applications are combined in one chip
- Sep eMemory breaks new ground launching industrial-grade embedded NVM for power management solution
- Jul eMemory’s NeoBit OTP production reaches 1 million wafers; IP solutions for 65 nm processes launched
- May eMemory announces NeoROM, a low-cost OTP mass production solution
- Jan NeoFlash in 0.13um process demonstrates ultra-low power program/erase performance
2008
- Dec Production of NeoBit reaches 900,000 wafers
- Dec NeoFlash qualified in 0.18um ULL process
- Nov 0.13um high-voltage NeoBit process for LCD driver applications goes into mass production
- May eMemory licenses technology to Fujitsu Microelectronics Limited
- Feb Production of NeoBit reaches 400,000 wafers
2007
- Nov NeoBit qualified in 0.13um high-voltage process for LCD driver applications
- Oct Production of NeoBit reaches 300,000 wafers
- Sep eMemory licenses technology to Magnachip
- Jul eMemory licenses technology to NECEL
- Jul eMemory customers adopt 0.13um NeoBit in mass production
- Mar Production of NeoBit reaches 150,000 wafers
2006
- Oct NeoBit production reaches 100,000 wafers
- Jul eMemory provides high voltage NeoBit processes and improves wafer yield and performance
- Apr Advance NeoFlash embedded non-volatile memory technology is qualified
- Apr eMemory licenses technology to Silterra
- Mar eMemory licenses technology to NJRC
- Mar eMemory licenses technology to OKI
2005
- Oct eMemory licenses technology to Toshiba
- Jun Production of NeoBit reaches 10,000 wafers
- Apr eMemory licenses technology to Ricoh
- Apr eMemory licenses technology to Powerchip Semiconductor Corporation (PSC)
- Mar eMemory announces NeoBit prototype in 0.13um process
- Jan eMemory announces NeoBit applications for speech IC
- Jan eMemory licenses technology to Vanguard International Semiconductor Corporation (VIS)
2004
- Oct eMemory announces NeoBit prototype in 0.11um technology for DRAM redundancy
- Oct eMemory provides 0.18um NeoBit OTP/MTP solutions for LCD driver IC
- Aug eMemory announces NeoBit applications for RFID
- Jun eMemory announces NeoBit applications for trimming circuit in LCD driver
- Jan eMemory licenses technology to Chartered Semiconductor
2003
- Oct eMemory announces NeoBit applications for electrical fuse
- Sep eMemory licenses technology to Taiwan Semiconductor Manufacturing Company (TSMC)
- Apr eMemory licenses technology to Renesas Technology
- Apr eMemory announces NeoBit applications for ROM replacement in MCU
2002
- Nov eMemory licenses technology to Chartered Semiconductor
- Apr eMemory licenses technology to Mitsubishi Electric