News and Events

eMemory Receives 2018 TSMC IP Partner Award

2018/10/04

Hsinchu, Taiwan (October 4, 2018) –eMemory, the IP provider of logic-based embedded non-volatile memory (Logic NVM), announced today that it received TSMC’s Open Innovation Platform® (OIP) “Embedded Memory IP Partner Award” of 2018.
The company has received this honor in the “Specialty Embedded Memory IP” category every year from the award’s inception in 2010. Over the past few years, eMemory has collaborated closely with the TSMC in delivering reliable logic NVM IPs and services across a range of TSMC process nodes.

In the most recent year, eMemory has completed verification of its NeoFuse IP on TSMC’s 12nm platform and has been taped out on 7nm, 22nm and 80nm 6V/8V HV platforms. It has also completed qualifications of NeoMTP on 110nm HV-MR.  
“For years we’ve witnessed eMemory’s persistent efforts in delivering top-notch IPs and services,” said Suk Lee, Senior Director of Design Infrastructure Marketing Division at TSMC. “This award recognizes the company’s capabilities of providing reliable IPs as well as its excellent technical support and customer service.”

"The prestige of this award is such that it’s always been a tremendous boost for us to aim for higher year after year,” said Rick Shen, President of eMemory. “It’s been our commitment to being relentlessly innovative and providing best-of-class IPs to clients, and we’ll continue to work closely with TSMC to achieve that."

The partnership between eMemory and TSMC began in 2003. Since then the IP provider has deployed NeoBit, NeoFuse, NeoEE, and NeoMTP across a range of TSMC platforms.  

The selection criteria of TSMC’s IP Partner Award include customer feedback, TSMC9000 compliance, number of customer tape-outs and number of wafers shipped. The award ceremony was held on October 3rd in Santa Clara, Calif. U.S., during TSMC’s annual Open Innovation Platform Ecosystem Forum.  

To date, over 370 of eMemory’s silicon IPs have been deployed on TSMC’s Open Innovation Platform. In addition, the company has completed more than 1,290 new tape-outs, and over 11 million eMemory-IP-embedded wafers have been shipped on TSMC platforms for a broad range of applications, including IoT, smartphone, automotive, and consumer electronics.

< Back