DRAM is widely used in digital electronics when low-cost, high-capacity memory is required. One of the largest applications for DRAM is the main memory in modern computers and graphics cards. It is also used in many portable devices and video game consoles.
Demand for DRAM keeps increasing due to the continued growth of automotive, industrial and 5G markets. Multi-chip packaging (MCP), which combines different memories into a single small package is the main trend for DRAM in mobile devices. MCP products allow the creation of richly featured devices in small form factors at a low hardware cost and operating at minimal power consumption. To meet the need for higher density and smaller form factors, DRAM manufacturing has entered the advanced 16/10nm FinFET node.
Defect density greatly increases when the DRAM manufacturing process enters 25nm and more advanced nodes. As DRAM density increases, there’s a need to allocate more fuse memory for DRAM repair. Laser fuses used to be the main solution for DRAM repair. Now, laser fuses fail to scale sufficiently with more recent DRAM shrinks, and as a result, poly e-fuse or even newer OTP technology have become more common solutions.
NVM Silicon IPs for DRAM
eMemory’s OTP is compatible with existing DRAM processes and can be used for DRAM repair in both chip probing tests and final tests to achieve multi-time repairs, thus reducing the cost of laser trimming and time for repair setup and facilitating manufacturing flow. This post-packaging chip repair capability also significantly improves yield and benefits for MCP products.
eMemory’s OTP also provides a wide range of VDD and VDDIO operations to make product design more flexible and save power as it is used for repair, trimming and identification in DRAM products. Moreover, our OTP’s high programming yield — requiring only a single-shot-programming pulse — greatly reduces the complexity of operations and testing costs.
Features and Benefits
|Flexible usage and testability||Wide Range VDD support||Logic compatible and ready for advanced processes|
|eMemory’s OTP IPs are flexible building blocks for chip designers to develop tailored solutions for DRAM applications. They can be customized to support DRAM repair while improving manufacturing and testing operations.||The wide operating voltage of eMemory’s OTP IPs facilitate early readiness for data setting and trimming, which boosts power efficiency and makes product design more flexible.||eMemory’s OTP IPs are available in standard logic process platforms with no additional masks, providing chip designers the advantages of advanced process availability, design portability and low power requirements.|